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Work mode
On-site
Experience
Some experience
About the role
Join the High Bandwidth Memory Product and Systems Engineering Industrial Engineering team at Fab 10A for a structured internship project. You will work on improving visibility and planning of High Bandwidth Memory sample workflows using data analytics, dashboards and Artificial Intelligence. This role suits students pursuing a degree in Industrial Engineering, Systems Engineering, Computer Science, Data Science, Business Analytics or a related field who enjoy analytical problem-solving.
What you'll do
Map and document the end-to-end High Bandwidth Memory sample workflow across Die Bank, probe, test, shipment and reliability operations
Collect, clean and analyse sample-management data from manufacturing and planning systems
Develop predictive models for sample arrival and reliability start dates
Forecast burn-in and reliability resource demand to support planning
Build Power BI or Tableau dashboards for work-in-progress tracking, resource forecasting, capacity visibility and execution-risk monitoring
Create automated notifications and an alert prototype for upcoming sample arrivals and readiness actions
Identify workflow bottlenecks and recommend process improvement and automation opportunities
Prepare a final report and presentation covering findings, model performance, recommendations and potential automation opportunities
Good to know
Full-time internship of 5 months from January to May 2027
Based at Fab 10A, 1 North Coast Avenue, Singapore 757432
High-performing interns may be considered for future internship or full-time opportunities, subject to business needs and hiring requirements
Requirements
Strong analytical thinking and structured problem-solving skills
Familiarity with data-analysis and visualisation tools such as Excel, Power BI, Tableau, Python or SQL
Interest in semiconductor manufacturing, sample logistics, workflow optimisation and business intelligence
Good communication, teamwork, documentation and presentation skills
Pursuing a Bachelor's or Master's Degree in Industrial Engineering, Systems Engineering, Computer Science, Data Science, Business Analytics or a related field
Able to commit to a full-time internship of 5 months from January to May 2027
Benefits
Hands-on exposure to semiconductor sample logistics, process documentation, predictive analytics, business intelligence and workflow optimisation
Collaboration with engineering, planning, operations and information technology stakeholders
Learning opportunities in data preparation, predictive modelling, dashboard development and workflow automation
Exposure to Manufacturing Execution Systems and enterprise planning systems
Development of process-mapping, structured problem-solving, technical documentation and stakeholder-communication skills
Exposure to Artificial Intelligence and AI-Enabled workflows in semiconductor planning and operations
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