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Not stated
Work mode
On-site
Experience
Some experience
About the role
This role sits with the Product Development Engineering Key Equipment Group, focused on bringing new highly automated equipment and technology into an advantage packaging environment. You will work closely with production, suppliers and cross-functional teams to evaluate, qualify and hand over new equipment platforms. It suits an engineer who is independent, analytical and comfortable managing projects to timelines.
What you'll do
Identify, select and evaluate new automated equipment and technology for current and future packaging needs
Support evaluation and qualification of new equipment platforms
Define and establish equipment design and capability requirements aligned to the process and packaging roadmap
Develop creative solutions for equipment capability gaps or future technology needs
Work with equipment suppliers to develop new capabilities
Take part in package development engineering activities
Conduct equipment benchmarking to establish suppliers and platforms for future needs
Assist senior engineers with benchmarking and selection
Plan and submit capital requests to acquire new equipment
Create and own the purchasing specification document
Establish qualification criteria and an activities roadmap with functional teams
Set project handover requirements and procedures after machine qualification
Prepare handover documentation with the site owner
Gather data for low volume production
Conduct training for site representatives
Run continuous improvement feedback loops with production and high-volume manufacturing teams
Maintain the Equipment Maturity Index and Tool of Records matrix for current and new platforms
Update the Tool of Records with inputs from local and other assembly sites
Keep general knowledge of process and material characteristics and translate them into equipment design requirements
Continually search for new equipment or suppliers with improved capability aligned to process and packaging needs
Conduct equipment characterization and enable critical parameter monitoring systems
Work with process control, IT and automation teams to enable tool control systems such as FDC, E3, APC, tool alarms, IoT, ECM and R2R
Enable equipment automation for host communication and automated material handling system readiness
Take part in supplier engagement forums including executive, technical and quarterly business reviews
Support equipment improvement initiatives with senior engineers and suppliers
Collaborate with suppliers on technology pathfinding, engineering improvement and manufacturing efficiency
Good to know
Based at MSB, Singapore
Seasonal travel may be required based on business needs
Performs hardware and software engineering assignments as required
Requirements
PhD, Masters or bachelor's degree in Electrical & Electronic, Material, Mechanical Engineering, Physics or Applied Physics, or equivalent work experience
Basic knowledge of semiconductor manufacturing assembly, wafer bumping packaging and advanced packaging techniques
0-2 years' experience in the semiconductor industry or a related manufacturing environment
Technical knowledge of assembly, wafer bumping or advanced packaging is a plus
Understanding or experience in equipment automation solutions is a plus
Fast learner with initiative and independence, able to work with minimal supervision
Apply on the company website
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