Intern - F10 PEE WET

About the role

Join the Process Engineering team for a structured internship focused on wafer thermal management and plasma strip process optimisation. You will investigate how chuck temperature affects wafer thermal behaviour, film properties and process performance. The role involves planning experiments, running Design of Experiments studies, statistical analysis, process modelling and data visualisation. You will also gain exposure to AI-enabled data exploration and predictive analytics, and contribute data-based recommendations to improve process robustness, yield, productivity and cost performance. You will work under the guidance of experienced engineers and present your findings in a final technical report and presentation.

Requirements

• Pursuing a bachelor's or master's degree in chemical engineering, materials science, mechanical engineering, electrical engineering, physics or a related discipline
• Strong analytical, experimental and problem-solving skills
• Familiarity with statistical analysis, Design of Experiments, data visualisation or process modelling
• Experience with Microsoft Excel; exposure to Python, JMP, Minitab or Power BI is advantageous
• Able to commit to a full-time internship of at least four months

Benefits

• Exposure to semiconductor manufacturing, plasma processing and wafer thermal management
• Hands-on experience with Design of Experiments, statistical analysis and process modelling
• Exposure to machine learning, predictive analytics and generative AI in a process-engineering context
• Possible consideration for future internship or full-time opportunities based on performance and business needs