Full-timeTech & engineering· Posted 16 Sept

NTI Physical Failure Analysis Technician

MicronFrom company site

Salary

Not stated by the company

When

Full-time hours

Where

Singapore

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Start: Not stated
Work mode: On-site
Experience: Some experience

About the role

This role sits with the NAND Technology Integration Yield Enhancement group in Singapore, where you will carry out physical failure analysis for next-generation memory products. You will work alongside engineers from various technical backgrounds to trace yield issues back to their source. It suits someone hands-on with lab analysis tools who enjoys problem solving and wants to grow their knowledge of semiconductor memory and fabrication.

What you'll do

Perform physical failure analysis on next-generation products and communicate the failure mechanisms found
Support root cause analysis for yield issues
Use physical analysis tools including acid hood operation, polish wheel, wet and dry etch delayering, SEM, dual beam FIB and STEM lamella creation

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Help transfer physical failure analysis processes into production

Delayer failing devices using wet and dry techniques

Use Focused Ion Beam and STEM/TEM for cross section analysis and SEM for top-down analysis

Generate slice and view images to feed back into inline process improvement

Identify and raise awareness of new failure mechanisms

Apply a continuous improvement mindset to the area's operations

Integrate AI-assisted tools and insights into daily work while following organisational standards, and share AI-enabled improvements within your scope

Collaborate with EFA engineering to quickly identify visual defects behind yield issues

Find creative ways to improve efficiency and shorten the time needed to visualise root cause failures

Interpret and summarise data, then present it to engineers in writing and verbally

Build new techniques and find better ways to use existing tools to spot new failure mechanisms

Test new processes by evaluating techniques that improve productivity

Take ownership of PFA tools to keep uptime at maximum

Good to know

Based at Fab 10N/X, Singapore
The Yield Enhancement group draws engineers from Chemical, Materials, Electrical, Statistics and device physics backgrounds
The team routinely uses bench testers, emission and laser techniques for fail isolation, plus FIBs, SEMs and TEMs for root cause work

Requirements

ITE or Diploma in an electronics related field, or equivalent experience
Hands-on experience with physical analysis tools such as acid hood, polish wheel, wet/dry etch delayering, SEM, dual beam FIB and STEM lamella creation
Knowledge of physical failure analysis on semiconductor devices
Self-motivated and enthusiastic about finding creative solutions
Passionate about learning semiconductor memory and fabrication
Good analytical and problem-solving skills

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NTI Physical Failure Analysis Technician

About the role

What you'll do

Good to know

Requirements

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