Dry Etch MTS/Principal Engineer, Process Development SG, Advanced NAND

About the role

Lead dry etch process development for next-generation NAND research and development. Develop and innovate dry etch processes to meet structural and electrical specifications, and manage dry etch chambers to achieve program and yield targets. Work with hardware teams on the equipment roadmap and collaborate with process integration and other module areas such as Wet Etch, CVD, Diffusion, Metals, Lithography and CMP. Mentor less experienced engineers, present technology roadmaps, and provide project updates to upper management. Integrate AI-assisted tools into daily work and contribute to continuous improvement within your scope.

Requirements

• PhD with at least 5 years, or Master's degree with at least 7 years, in a relevant engineering or science field
• At least 6 years of dry etch process development experience
• At least 5 years of NAND, DRAM or Logic module development experience
• Knowledge of plasma physics, plasma chemistry, transport or surface phenomena
• Experience with plasma dry etch reactors such as RF sources and chemistries
• Expertise in statistical process control and analysis