MicronFrom company site
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Salary
Not stated by the company
Where
Fab 10A, Singapore
When
You will join the Package Development Engineering Team for Advanced Packaging, supporting next-generation memory and HBM packaging technologies with a focus on moving new products from development into high-volume manufacturing. You will apply engineering and statistical methods to speed up learning cycles from Design of Experiments through product qualifications. You will work with development and manufacturing teams on low volume manufacturing and run-at-risk builds, and perform risk assessments such as FMEA while putting control plans and corrective actions in place for abnormal conditions. You will also use AI-assisted tools in your daily work and share improvements within your scope. Operations support, including shift and weekend coverage, is required.
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