Full-timeTech & engineering· Posted 16 Sept

ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI)

MicronFrom company site

Salary

Not stated by the company

When

Full-time hours

Where

Singapore

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Start: Not stated
Work mode: On-site
Experience: Some experience

About the role

This role sits within the Package Development Engineering Team for Advanced Packaging in Singapore, supporting next-generation memory and HBM packaging technologies. The main focus is moving new products from development into high-volume manufacturing, working closely with development, manufacturing and supplier teams across Micron's global network. It suits an individual contributor with a semiconductor background who enjoys hands-on engineering and cross-functional collaboration.

What you'll do

Use AI-assisted tools and insights in daily work to improve efficiency, quality or effectiveness.
Help build a continuous improvement culture by identifying, testing and sharing AI-enabled enhancements within your scope of work.

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Apply engineering and statistical methods to speed up learning cycles, from Design of Experiments (DOE) through product qualifications.

Work with Advanced Package Technology Development (APTD) and manufacturing teams to support Low Volume Manufacturing (LVM) and Run at Risk (RAR).

Carry out risk assessments such as Failure Mode & Effect Analysis (FMEA) and put in place control plans and corrective actions for abnormal conditions.

Support smooth technology transfer from development to high-volume manufacturing.

Good to know

Operations support, including shift and weekend coverage, is required.
Based at MSB, Singapore.

Requirements

Bachelor's degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering or a related discipline
Willing to provide operations support, including shift and weekend coverage
Strong analytical, logical and critical thinking skills
Effective communicator who can collaborate across all levels
Growth mindset with a passion for continuous learning
Able to apply digital fluency and AI literacy to use AI-enabled tools responsibly for research, analysis, content creation, problem-solving and operational tasks

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ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI)

About the role

What you'll do

Good to know

Requirements

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