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Salary
Not stated by the company
Where
Fab 10A, Singapore
When
You will be a key technical contributor in the High Bandwidth Memory (HBM) Product Engineering team, driving Media Health manufacturing execution for next-generation HBM products including DRAM die, interface die and stacked HBM solutions. Your work covers manufacturing test flow development and validation, device- and stack-level yield improvement, and delivery of optimised reliability through circuit debug and test coverage optimisation. You will drive test time reduction, improve manufacturing efficiency, and contribute to Design-For-Test strategy development. You will work closely with cross-functional partners such as Fab, Product Leads, Design Engineering, Technology Development and Test Solutions Engineering. The role also involves mentoring others, project management and using AI-powered tools and automation to improve productivity.
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