Full-timeTech & engineering· Posted 16 Sept

Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory

MicronFrom company site

Salary

Not stated by the company

When

Full-time hours

Where

SingaporeFab 10A, Singapore

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Start: Not stated
Work mode: On-site
Experience: Some experience

About the role

This role sits within the HBM Systems and Product Engineering team at Fab 10A, focused on package and HBM product engineering for next-generation memory products. You will join a global group of product engineers working on quality, cost, cycle time and scale, collaborating with teams across and beyond HBM. It suits an experienced semiconductor engineer who enjoys cross-functional technical work and driving yield and quality improvements.

What you'll do

Improve assembly-related coverage in manufacturing flows to raise Time 0 and field DPM and reduce inline fallout

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Improve HBM cube yield through test optimisation and coverage, working with Technology Development and Packaging teams

Lead cross-functional initiatives that lift cumulative yield and quality

Debug packaging qualification and RMA failures using electrical and physical failure analysis, then drive fixes

Establish a process conversion business process with Fab, Technology Development, Advanced Packaging TD and Package Development teams

Recommend new process conversions to cut cost and raise yields

Work with Fab, HBM Technology Development, HBM Design, System Development and Quality/Reliability teams on end-product development and shipping

Promote innovation and changes that give a technical edge over competitors

Build project management skills within the team for timely delivery of technical solutions

Make final decisions on risk analysis and project prioritisation

Collaborate on developing, deploying and validating AI/ML models to improve quality, cost, cycle time and scale

Good to know

Work is on site in Singapore, with international travel to Taiwan, US and Japan

Requirements

Bachelor's or Master's degree in Electrical, Electronic or Mechanical Engineering
At least 3 years of semiconductor industry experience
Product engineering and packaging experience preferred
Strong technical problem solving with root cause analysis and circuit analysis
Knowledge of statistics, data analysis tools and scripting
Experience handling test flows

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Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory

About the role

What you'll do

Good to know

Requirements

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