A*STARFrom company site
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You will join the Wafer-to-Wafer (W2W) Bonding Module as a Research Engineer, focusing on Temporary Bonding and Debonding (TBDB) processes that are key to advanced semiconductor packaging of ultra-thin wafers. The position centres on developing, optimising and stabilising these processes to support next-generation packaging technologies. It suits someone with a materials, engineering, physics or chemistry background who enjoys hands-on process work and data-driven problem solving.
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A*STAR
S$15,129–15,925per month
Coinbase
Kuehne+Nagel
Kuehne+Nagel
Standard Chartered
Standard Chartered
NUS