Research Fellow (Flexible Electronics)

About the role

Develop soft, stretchable interconnect technologies for next-generation flexible electronic devices. Design, fabricate and characterise stretchable interconnects and bonded joints on soft substrates using printable conductive materials and low-temperature or photonic bonding methods. Conduct microstructural, chemical, mechanical and electromechanical characterisation, including reliability testing under bending, stretching and cyclic deformation. Collaborate with interdisciplinary researchers to integrate soft-interconnect solutions into stretchable devices and sensors. Assist with manuscript preparation, conference presentations, grant development and reporting, and mentor junior researchers where required.

Requirements

• PhD in Materials Science, Electronic/Electrical Engineering, Mechanical Engineering, Microelectronics, Chemistry or related discipline
• Research experience in flexible/stretchable electronics interconnection, printed electronics, conductive inks, soldering, interfacial joining or low-temperature bonding
• Background in interfacial and interconnect engineering and characterisation of bonded and printed interfaces
• Strong publication record in reputable journals
• Good written and oral communication skills
• Ability to work in a multidisciplinary collaborative environment