Full-timeTech & engineering· Posted 3 Oct

Scientist (Heterogeneous Integration), IME

A*STARFrom company site

Salary

Not stated by the company

When

Full-time hours

Where

Singapore

Apply on company site

How well do you match? Check in 10 seconds →

Free with a WorkJio account: we compare your profile with this job and show what you already meet.

Share with a friend

Start: Not stated
Work mode: Hybrid
Experience: Experienced

About the role

The Heterogeneous Integration Department at the Institute of Microelectronics is hiring a Scientist or Senior Scientist to work on advanced chip packaging research. You will join a research team focused on hybrid bonding and 2.5D/3D integration, working alongside process integrators and external partners. This suits a PhD holder with up to five years of experience who enjoys hands-on process development and mentoring others.

What you'll do

Work with senior staff, process integrators and external partners on technology roadmaps, process capability needs and business challenges
Lead high-impact projects with manageable risk and mentor less experienced colleagues
Plan and conceive projects involving new materials, advanced process integration approaches and innovative concepts

Know someone for this? Share it

WhatsApp Telegram Facebook LinkedIn

Research and develop advanced packaging technology such as flip-chip and hybrid bonding for 2.5D and 3D IC applications

Study and improve wafer bonding processes for interposer fabrication, inter-dielectric gap fill and alignment accuracy, covering warpage, bonding strength and yield

Optimise die bonding processes, including low-temperature organic and inorganic bonding materials, surface preparation and bonding methods

Run engineering experiments for process characterisation to improve quality and yield

Carry out reliability characterisation of hybrid-bonded packages

Serve as a subject matter expert for internal and external stakeholders

Mentor talent in semiconductor technology and support workforce development

Good to know

Work with minimal supervision as part of a team

Requirements

PhD in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field
0 to 5 years of experience in microelectronic devices, circuits and hybrid component integration, or 2.5D/3D heterogeneous integration applications
Knowledge of hybrid bonding or flip chip bonding is an advantage
Strong knowledge of hybrid bonding equipment technologies, bonding materials and methodologies, and reliability characterisation is preferred
Strong analytical and problem-solving skills
Proficiency in data analysis, interpretation and design of experiments

Apply on the company website

You will leave WorkJio. Never pay a fee or share your Singpass password, OTP or bank log-ins to apply.

Open application

Listed from A*STAR’s own careers page and not yet verified by WorkJio. You apply on the company’s site. See all their roles.

Is this your company? Roles that show a salary rank higher on WorkJio. Claim or remove this listing

Scientist (Heterogeneous Integration), IME

About the role

What you'll do

Good to know

Requirements

More jobs like this

Head, Infrastructure Delivery

Development Manager - DLT

Associate Engineer (Lab Tech)

Associate Director (AI Platform Engineering)

Systems Engineer (CBDS/HPC)

Senior Scientist, Autonomous Systems & Robotics, ARTC