Full-timeTech & engineering· Posted 16 Sept

Senior Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High…

MicronFrom company site

Salary

Not stated by the company

When

Full-time hours

Where

SingaporeFab 10A, Singapore

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Start: Not stated
Work mode: On-site
Experience: Experienced

About the role

You will join the Heterogeneous Integration Group's High Bandwidth Memory team as a Package Product Engineer based at Fab 10A in Singapore. This role sits within a global group of product engineers responsible for next-generation HBM products, with a focus on quality, cost, cycle time and scale. It suits an experienced semiconductor engineer who enjoys cross-functional work and technical problem solving.

What you'll do

Improve assembly-related coverage in manufacturing flows to raise Time 0 and field DPM and reduce inline fallout
Lift HBM Cube yield through test optimisation and coverage, working with Technology Development and Packaging teams to cut manufacturing line yield loss

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Own cumulative yield and lead initiatives with cross-functional teams to improve overall yield and quality

Debug qualification and RMA packaging issues using electrical and physical failure analysis, then drive fixes with cross-functional partners

Establish a robust process conversion business process with Fab, Technology Development, Advanced Packaging TD and Package Development teams, and recommend new conversions to reduce cost and raise yields

Work with Fab, HBM Technology Development, HBM Design, System Development and Quality/Reliability teams to support holistic product development and shipping

Promote innovation and drive changes that give a technical edge over competitors

Build project management skills within the team for efficient project execution and timely delivery

Make final decisions on risk analysis and project prioritisation

Collaborate with cross-functional teams to develop, deploy and validate AI/ML models that improve quality, cost, cycle time and scale KPIs

Good to know

On-site role in Singapore
International travel opportunities to Taiwan, US and Japan

Requirements

Bachelor's or Master's degree in Electrical, Electronic or Mechanical Engineering
At least 5 years of semiconductor industry experience
Product engineering and packaging experience preferred
Strong technical problem solving with root cause analysis and circuit analysis
Knowledge of statistics, data analysis tools and scripting
Experience handling test flows

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Senior Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High…

About the role

What you'll do

Good to know

Requirements

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