Full-timeTech & engineering· Posted 3 Oct
Senior Scientist (C2W bonding), (HI), IME
A*STARFrom company site
Salary
Not stated by the company
When
Full-time hours
Where
Singapore
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- Start
- Not stated
- Work mode
- Hybrid
- Experience
- Experienced
About the role
The Institute of Microelectronics (IME) is hiring a Scientist or Senior Scientist to act as a Process Integrator for Advanced Package Assembly within its Advanced Packaging Program. You will advance chip-to-wafer and chip-to-chip fine pitch micro-bump thermal compression bonding, hybrid bonding, underfilling and moulding, and develop 2.5D interposer and 3D chip stacking integration flows for heterogeneous chiplet integration. This role suits a semiconductor process expert who enjoys hands-on cleanroom work and collaborative research.
What you'll do
- Lead flip chip bonding process development to scale down micro bump bonding and chip-to-wafer hybrid bonding for heterogeneous chiplet integration.
- Develop assembly process integration approaches for complex novel system-in-package architectures.
