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Experience
Experienced
About the role
This is a senior engineering role in a next-generation NAND research and development dry etch team at a semiconductor fab. You will own chemical mechanical planarization process development for advanced 3D NAND nodes, working closely with process integration and other process areas. It suits an experienced CMP specialist who enjoys deep technical work, cross-site collaboration and mentoring others.
What you'll do
Develop and optimize chemical mechanical planarization procedures to improve product quality and reliability for next-generation memory parts
Improve process margins needed to hit mature yield goals for 3D NAND parts
Carry out fundamental research, consumables development, hardware evaluation and testing of processes for novel applications
Initiate and manage experiments to widen process margins and assess manufacturability of next-node solutions
Collaborate extensively with vendors to develop processes meeting integration requirements for current and future 3D NAND nodes
Apply best known manufacturing methods during early development of upcoming nodes
Design and implement advanced process monitoring and control methods
Provide a strategic roadmap for N+, N++ and future NAND nodes
Serve as a technical expert on projects improving processes, procedures and equipment
Define and lead complex, multi-functional projects of critical importance, helping set strategic direction
Advise management on significant technical issues and lead innovation projects through patents and technical papers
Communicate and collaborate with partners locally and globally, adhering strictly to intellectual property protection policy
Mentor new hires and less experienced team members on CMP fundamentals, process development and company systems
Engage with procurement, operations central teams and other partners locally and globally to drive breakthrough solutions
Lead or drive teams and sites on complex, multi-disciplinary projects in quality, process and yield improvement, cost and productivity meetings
Integrate AI-assisted tools and insights into daily work to improve efficiency, quality or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements
Contribute to continuous improvement by identifying, testing and sharing AI-enabled enhancements within your scope of work
Good to know
Based at Fab 10N/X, Singapore
Full-time position
Role involves local and global collaboration and travel between sites is implied by remote communications
Requirements
Masters or PhD with 5–10 years, or Bachelors with 7–12 years, of relevant semiconductor industry experience
Background in chemical mechanical planarization process in 300mm wafer fabrication
Hands-on experience operating CMP equipment such as AMAT (LKP), EBARA-300X and next-generation tools
Familiarity with optical metrology, profilometry, polishing slurries, conditioners and polishing pads
Experience in dielectrics or metals CMP process development on 3D NAND or other memory technology
Understanding of integration and structural impacts and constraints related to film deposition and upstream/downstream processes
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