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这是一个半导体晶圆厂下一代 NAND 研发干蚀刻团队的高级工程职位。您将负责先进 3D NAND 节点的化学机械平坦化工艺开发,与工艺整合及其他工艺领域紧密合作。适合经验丰富的 CMP 专家,喜欢深入技术工作、跨站点合作和指导他人。
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