MicronFrom company site
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Salary
Not stated by the company
Where
Fab 10A, Singapore
When
You will develop and run package health monitoring, simulation and characterisation activities. This includes defining quantitative package health metrics, building detection mechanisms and monitoring dashboards, and performing electrical and mechanical characterisation of packages. You will implement real-time defect detection and classification, conduct next-level characterisation for critical defects, and feed findings into predictive models. You will also study correlations between process variables, defect patterns and reliability outcomes, and maintain a structured knowledge base for package health learnings. The role involves working with process, equipment and reliability teams to establish traceability across wafer, assembly and test stages, and building data pipelines and tools.
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