InternshipOperations & management· Posted 25 Aug
College Intern - Process and Digitalization
HPFrom company site
Salary
Not stated by the company
When
To be confirmed
Where
Singapore
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- Start
- Not stated
- Work mode
- On-site
- Experience
- Some experience
About the role
This internship sits with the engineering and operations team at HP's manufacturing site in Singapore, where you'll help build smart factory solutions for semiconductor packaging. It suits students in engineering, automation, data science or a related discipline who want hands-on exposure to high-volume manufacturing and digitalisation projects.
What you'll do
- Work with engineers to build manufacturing solutions using AI, IIOT, smart vision systems and other automation tools
- Get practical exposure to high-speed, high-precision die attach, wire bonding, chip attach and over-mold equipment in a high-volume semiconductor packaging setting
- Take part in concurrent projects covering current production, sustainability and new product introduction
