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该职位属于Fab 10A的工艺与设备工程团队,负责先进和传统封装的缺陷检测和量测解决方案。您将支持新产品导入、HBM技术量产爬坡和大规模制造,因此适合具有强大半导体制造和数据分析背景的工程师。
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