Full-timeTech & engineering· Posted 2 Oct

Senior Scientist, Optical Interconnect Integration, IME

A*STARFrom company site

Salary

Not stated by the company

When

Full-time hours

Where

Singapore

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Start: Not stated
Work mode: On-site
Experience: Experienced

About the role

This role sits within IME in Singapore, focusing on optical interconnect integration for advanced packaging. You will work on Co-Packaged Optics and heterogeneous integration platforms, collaborating with internal teams and external partners. It suits a scientist with strong photonics and packaging background who enjoys both design and hands-on characterization.

What you'll do

Support optical interconnect integration using 2.5D and 3D advanced packaging approaches.
Generate package design layouts, process-flow concepts, test vehicle plans, and validation strategies.
Coordinate fabrication, assembly, and integration of optical interconnect test vehicles with internal teams and external partners.

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Develop package-level and wafer-level optical interconnect solutions for Co-Packaged Optics and heterogeneous integration platforms.

Perform optical simulation and analysis for coupling loss, alignment tolerance, package-stack effects, and interface performance.

Design and evaluate optical coupling structures such as grating-coupler, edge-coupler, lens-assisted, and fiber-array-based interfaces.

Develop passive fiber alignment concepts and detachable low-loss optical connector schemes for high-density optical I/O.

Contribute to optical interconnect architectures for GPU–GPU, GPU–memory, and multi-chiplet system-level packaging.

Perform optical and electro-optical characterization including optical loss, coupling efficiency, high-speed modulation response, eye-diagram, and link-level performance.

Support package-level electro-optical testing using optical, RF, and high-speed measurement setups.

Propose new concepts to improve coupling efficiency, alignment tolerance, manufacturability, and testability of next-generation CPO platforms.

Good to know

Location: Singapore.

Requirements

Strong understanding of optical interconnect integration and advanced packaging for Co-Packaged Optics and heterogeneous integration.
Knowledge of optical coupling mechanisms, loss sources, alignment tolerances, and package-induced performance variations.
Familiarity with photonic integration platforms such as Silicon Photonics, Indium Phosphide, and Thin-Film Lithium Niobate, including edge-coupler and grating-coupler interfaces.
Understanding of passive and active optical alignment for fiber-array and chip-level coupling structures.
Knowledge of wafer-level and package-level fabrication processes including lithography, plasma etching, wafer thinning, bonding, molding, and dicing.
Familiarity with optical simulation and analysis tools for coupling efficiency, alignment sensitivity, and interface performance.

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Senior Scientist, Optical Interconnect Integration, IME

About the role

What you'll do

Good to know

Requirements

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