Develop soft, stretchable interconnect technologies for next-generation flexible electronic devices. Design, fabricate and characterise stretchable interconnects and bonded joints on soft substrates using printable conductive materials and low-temperature or photonic bonding methods. Conduct microstructural, chemical, mechanical and electromechanical characterisation, including reliability testing under bending, stretching and cyclic deformation. Collaborate with interdisciplinary researchers to integrate soft-interconnect solutions into stretchable devices and sensors. Assist with manuscript preparation, conference presentations, grant development and reporting, and mentor junior researchers where required.